Electronics Packaging ForumElectronics Packaging Forum

It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Author: James E. Morris

Publisher: Springer Science & Business Media

ISBN: 9789400904392


Page: 460

View: 420

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Chip On BoardChip On Board

Lau , J. H. , Thermal Stress and Strain in Microelectronics Packaging , Van
Nostrand Reinhold , New York , 1993 . 14. Lau , J. H. ... Morris , J. E. , Electronics
Packaging Forum , Volume 1 , Van Nostrand Reinhold , New York , 1990 . 26.

Author: John H. Lau

Publisher: Springer Science & Business Media

ISBN: 0442014414


Page: 556

View: 739

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Materials for Electronic PackagingMaterials for Electronic Packaging

... subtleties of various techniques. And special thanks to Ken Kreider of NIST for
his review and critique. References 1. E.S. Meieran, P.A. Flinn, and J.R.
Carruthers, Proc. IEEE 75,908 (1987). 2. L. Kashar, in Electronics Packaging
Forum, Vol.

Author: Deborah D.L. Chung

Publisher: Elsevier

ISBN: 0080511171


Page: 368

View: 891

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Thermal Stress and Strain in Microelectronics PackagingThermal Stress and Strain in Microelectronics Packaging

Components, Hybrids, and Manufacturing Technology, 13(1), March 1990, pp.
183–188. Lau, J. H., S. J. Erasmus, and D. W. Rice, “An Introduction to Tape
Automated Bonding Technology,” in Electronics Packaging Forum, ed. J. E.
Morris, Van ...

Author: John Lau

Publisher: Springer Science & Business Media

ISBN: 9781468477672


Page: 884

View: 369

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Robust Electronic Design Reference Book no special titleRobust Electronic Design Reference Book no special title

Matisoff , Bernard S. , Handbook of Electronics Packaging Design and
Engineering , and Edition . New York : Van Nostrand Reinhold , 1990 , pp . 149-
162 , 377-391 . Morris , James E. , Electronics Packaging Forum : Multichip
Module ...

Author: John R. Barnes

Publisher: Springer Science & Business Media

ISBN: 1402077378


Page: 1500

View: 635

If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements.

Thirteenth IEEE CHMT International Electronics Manufacturing Technology SymposiumThirteenth IEEE CHMT International Electronics Manufacturing Technology Symposium

... An Introduction to Tape Automated Bonding Technology , ” Electronics
Packaging Forum , edited by Morris , J . , pp . ... C . Y . , Principles of Electronic
Packaging , McGraw - Hill Book Company , New York , NY , 1989 . onic
Packaging 7 .


Publisher: Institute of Electrical & Electronics Engineers(IEEE)

ISBN: 0780307569


Page: 381

View: 126

Electronic Packaging and Interconnection HandbookElectronic Packaging and Interconnection Handbook

Morris , J . E . ed . 1991 . Electronics Packaging Forum , Vol . 2 . New York : Van
Nostrand Reinhold . 86 . Munson , T . 1991 . “ Cleanliness Testing for the 90s by
lon Chromatography . ” IPC Technical Paper , IPC - TP - 938 . 87 . Pattison , W . L

Author: Charles A. Harper

Publisher: McGraw-Hill Companies

ISBN: UOM:39015040989835


Page: 900

View: 440

Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field

Space Technology and Applications International ForumSpace Technology and Applications International Forum

and power electronics fields. ... technology— hereafter termed multichip power
POWER MODULES ... MCM packaging is a refinement of hybrid packaging

Author: Mohamed S. El-Genk

Publisher: A I P Press

ISBN: UCSD:31822023702814


Page: 1566

View: 660

National Science Foundation NSF Forum on Optical Science and EngineeringNational Science Foundation NSF Forum on Optical Science and Engineering

Techniques for optoelectronic packaging Alan Rolf Mickelson Guided Wave
Optics Laboratory Electrical and Computer Engineering University of Colorado ...
Keywords : optics , optoelectronics , electronics , packaging , interconnection 1 .

Author: William H. Carter

Publisher: Society of Photo Optical

ISBN: UOM:39015034518186


Page: 210

View: 618


The ViperBGA would be the lowest stress package . make the final determination
, it is planned to take the temperature ... Electronics Packaging Forum , IEEE
Press , NJ , 1994 PO Switches from positive change to strongly negative at higher


Publisher: Institute of Electrical & Electronics Engineers(IEEE)

ISBN: 0780348508


Page: 547

View: 514

Annotation Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.

Electronics ManufacturingElectronics Manufacturing

... Developments, IEEE Press, New York, 1992. Hwang, J. S., Solder Paste in
Electronics Packaging, Van Nostrand Reinhold, New York, 1989. ... Morris, J. E.,
Electronics Packaging Forum, vol. 1, Van Nostrand Reinhold, New York, 1990.

Author: John H. Lau

Publisher: McGraw Hill Professional

ISBN: 9780071500876


Page: 700

View: 883

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives

Phenomenology and Applications of High Temperature SuperconductorsPhenomenology and Applications of High Temperature Superconductors

Components , Hybrids , Manuf . Technol . , Vol . CHMT - 12 , 577 ( 1987 ) . 18 .
Solid State Tech . , Jan . 1991 . 19 . D . Herrell and C . Hilbert , “ The Role of
Superconductivity in Electronics Packaging , ” in “ Electronics Packaging Forum ,
” ed .

Author: Kevin Bedell

Publisher: Addison Wesley Publishing Company

ISBN: UOM:39015025383996


Page: 537

View: 645